Helia’s high-accuracy bar scriber/cleaver LSD-155 from Loomis Industries uses highly refined vision algorithms to automatically find, align, and process material.
- Fully automatic wafer dicing & laser diode cleaving
- Extensive control software with customizable recipes and real-time process monitoring
- Volume Production Capability
- Submicron cleave positioning accuracy using vision system verification
- Custom Peck & Drop / Scribe & Break modes
- Coated bars can be arrayed directly on blue tape by HELBOT after unstacking for highest accuracy and full traceability.