In addition to our core Optical Coatings technologies, we offer a range of back-end processing services including semiconductor wafer cleaving, laser bar-to-die chipping (i.e. die singulation), wafer thinning/polishing and electro-optical laser bar testing. For free space optics we offer sawing, dicing and polishing facilities. In addition we can provide photolithography and extensive metrological and tribological characterisation testing services.
Cleaving, Polishing & Dicing
Explore our cutting edge range of services.
Laser Bar Test
Find out more about our electro-optical testing services.
An overview of the metrology services we can offer.