Services
Besides our core service of Optical Coatings we are proud to provide additional services. We regularly provide semiconductor wafer cleaving and laser bar-to-die chipping (also known as die singulation) services either as a part of or separate to our coating services. We can also carry out electro-optical testing for laser bars. For free space optics we can provide sawing, dicing and polishing services. In addition to these services, we can carry out film deposition photolithography and perform extensive metrological tests. Our web pages detailing these services are coming soon, in the meantime please contact us regarding your inquiry
Cleaving, Polishing & Dicing
Explore our cutting edge range of services.
Laser Bar Test
Find out more about our electro-optical testing services.
Photolithography
Discover our photolithography service.
Metrology
An overview of the metrology services we can offer.
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