Helia Photonics: the ultimate innovators in thin film optical coatings

In addition to our core Optical Coatings technologies, we offer a range of back-end processing services including semiconductor wafer cleaving, laser bar-to-die chipping (i.e. die singulation), wafer thinning/polishing and electro-optical laser bar testing. For free space optics we offer sawing, dicing and polishing facilities. In addition we can provide photolithography and extensive metrological and tribological characterisation testing services.