In addition to our core Optical Coatings technologies, we offer a range of back-end processing services including semiconductor wafer cleaving, laser bar-to-die chipping (i.e. die singulation), wafer thinning/polishing and electro-optical laser bar testing. For free space optics we offer sawing, dicing and polishing facilities. In addition we can provide photolithography and extensive metrological and tribological characterisation testing services.
Explore our cutting edge range of services.
Find out more about our electro-optical testing services.
An overview of the metrology services we can offer.
To contact Helia Photonics please call +44 (0)1506 414800 or email us via our contact form
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Helia Photonics Ltd
Rosebank Technology Park
+44 (0)1506 414800