List of Services
- Wafer Lap & Polish, 3&4” InP, GaAs, GaN, Si, Glass & Sapphire
- Back-metal contacts Ti/Ni/Ge/Pt/Au/Pd/Sn
- Rapid Thermal Anneal / RIE Etch / Wet Etch / Furnace
- Precision Cleave InP, GaAs, Si
- Robotic Autoloading 150µm CL +
- Facet Coatings AR/HR/HEAR/BBAR/DC/OC/DMD UV to LWIR
- Wafer-level Coatings AR/BBAR/HEHR/PPC VC & Etched Facet 3,4,6,8” wafers
- Bartest LIV/PIV & Spectral
- Life test & Emitter Mortality Analysis
- Wafer Saw and laser Dice of Si, Sapphire, SiC, and Diamond
- Automatic high-volume singulation of InP & GaAs
- Novel singulation GaN
- Automatic Inspection Wafer to Chip
- Die Sort, Pick & Place
- Optical coatings: Plasma & Ion Assisted Electron Beam Evaporation,
RF & DC Magnetron Sputtering, Ion Beam Sputtering, Thermal Evaporation - Microfilter Fabrication / Photolithography / Dicing / Measurement
- Waveguide Polishing & Coating
- Operation of additional customer consigned equipment for process flow optimisation
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