Helia Photonics: the ultimate innovators in thin film optical coatings

AI-powered automated inspection: HELVIEW leverages proprietary machine learning models and algorithms to automate defect inspection and grading of semiconductor wafers and devices.
Helia’s versatile HELVIEW system speeds up the microscopic inspection of wafers, bars, individual devices, and optics while ensuring image quality and resolution outclassing those of traditional microscopes.
Helia can assess products at every stage of processing using its own generic defect typology, or a customer-provided one.
We easily adapt to tailored binning protocols or custom inspection report formats and are used to working closely with customers to implement the best defect prevention strategies.

Key Features

Automated micrographs of >1000 chips/hr for high volumes
400 mm x 400 mm working area, high-speed XY stage with 5µm positioning accuracy. Ultrafine Z stage with autofocus.
Ultra-wide field of view & µm-level resolutions
Fully proprietary, modular, and adaptable control software
Cleanroom class 10000 environment, vibration-isolated

HELVIEW’s custom-built platform is modular and adapts to customer-specific inspection “recipes”.
The platform provides complete Helia traceability and direct integration with our automated pick & place and cleaving tools.
Sparse, singulated chips in waffle trays, gelpaks or blue tape are automatically detected and imaged at very high resolution.

To contact Helia Photonics please call +44 (0)1506 414800 or email us via our contact form