Cleaving
Critical to quality device performance – the cleave processes at Helia are developed to provide optimized performance for your application. With multiple cleaving systems, we can offer existing processes for crystal cleaving on InP, GaAs, GaSb, InAs, GaP, GaN, Si, and Ge; some of these in a protective atmosphere to prevent facet degradation; scribing of additional materials such as thin glass and amorphous materials and finally precision laser scribing of thick semiconductors, sapphire, and diamond.
Further systems at Helia are used for device singulation and for high volume can be used with our fully automated line where feature recognition is trained for high throughput, precision, and compatibilities with down-stream automated sort.
Supporting in-house metrology for cleaving optimization includes Optical Nomarski and SEM microscopy.
FOLLOW US
