Wafer Cleaving
Optical
Thin Film
Innovation
An IS09001:2008 & British Standard Kitemark company
Wafer Cleaving
• Vision assisted semi-automatic wafer to bar / bar to die cleave
• Fully automatic 2D chip scribe and break
• Low transfer tape – zero contamination
• Custom diamond tools for demanding applications
• Processes for GaAs, Si, Ge, InP and glass wafers