During a process design and qualification period, samples from each deposition run are subjected to a set of tests. Some of these are to ensure good adhesion to the substrate material, sometimes at elevated temperatures for die bonding purposes, sometimes at subzero temperatures to ensure continuous operation; other tests establish tribology standard, spectral shift, etc.

Name of test		Description
Tape Test		L-T-90 Test, Type 1 MIL-F-48616 4.6.8.1 with tape to MIL-M-13508
Severe Abrasion Test		Standard Eraser 2.25lbs 50 strokes to MIL-C-675 / MIL-F-48616 with eraser to MIL-E-12397
Accelerated Aging Test		No delamination after 3 Hours, 120°C 15psi Saturated humidity
Solder Test		Custom - Coated wafer piece 2mm² submerged for 1 minute in molten 60/40 solder at 320°C
Spectral Shift Test		Coating design on SF11 subjected to AA Test and spectral shift =Ordinance @ λmax pre - λmax post